This Optoelectronic Packaging Engineer will be responsible for developing semiconductor optoelectronic and other optical component packaging from proof-of-concept prototypes to final manufacturing design documentation and product qualification. This packaging engineer will use a combination of software design tools to develop packaging for advanced high power semiconductor devices for applications ranging from military, to medical, government, and telecommunications. The packaging engineer will also participate actively in developing methods and procedures to test new designs. In addition, this person will collaborate with semiconductor chip designers, process engineers, and test engineers to design for manufacturability, device performance, and continuous improvement in yields.

Skills and Knowledge:

• Strong Multi-Disciplinary Engineering Skills: Mechanical, Optical , Materials

• Experience Designing and Commercializing Active Opto-Electronics Components

• Semiconductor Lasers; Single-Mode or Multi Mode Fiber Coupled devices

• Proficient with Engineering Design Tools (e.g. Solid Works, Cosmos, Zemax)

• Good Communication Skills

• Familiar with Product Release Documentation Processes, Work Instructions, and SPC Implementation

• Able to work well in a team.

A Successful Candidate will interact with Broad Range of Other Engineers and Staff including Chip Designers, Process Engineers, Test/Reliability Engineers, Information Technology, Production Control, and Marketing/Sales.

Requirements:

• Bachelors or Master of Science in Laser Packaging, Electrical Engineering, Physics or Materials Science.

• 4+ Years Experience Developing Semiconductor Laser or Related Optoelectronic Device Packaging