Vertically Integrated Solutions

WAFER FAB

Built with innovation in mind.

CHIP/BAR PROCESSING

Sheaumann's brand-new 18,000 square foot 

cleanroom houses all activities, from wafer growth to test and reliability, under one roof. 

LASER PACKAGING

TEST & RELIABILITY

WAFER GROWTH

Wafer Growth

Epitaxial MOCVD wafer growth

  • GaAs: 780-1070nm

  • GaAs(P): 1070-1270nm

  • InP: 1275-1875nm

  • Single-mode and multimode

  • Three 3" wafers for easy prototyping and customization

Wafer Fabrication

  • Wet/dry etching

  • Si3N4/SiO2 

  • E-beam/sputtered metal

  • RTP-alloy

  • Ion-beam milling

  • PECVD

  • ICP-RIE

  • RIE

Chip and Bar Processing

  • Facet passivation

  • Custom facet coating

  • Flip-chip bonding

  • Indium/AuSn bonding

  • Automated bar probe testing

Laser Packaging

  • Two Nanosystec single-mode fiber alignment stations

  • Multimode fiber alignment

  • Soldering and welding

  • Ball and ribbon bonding

  • UV epoxy lens attachment

  • Hermetic sealing

  • Leak, noise, environment tests

  • Electro-optical characterization

  • MIL-SPEC design and testing

Test and Reliability

Our test and reliability processes are carried out in a Class 10,000 cleanroom.

  • Burn-in and reliability testing

  • Multichannel chip-on-submount testing

  • ILX 2-pin, 7-pin, 14-pin fiber-coupled package test

  • 1000/5000hr SM/MM wafer qualification

  • 50°C, 20% over Iop standard test conditions

  • Pre- and post-burn-in L-I-V characterization

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We Have Moved!

We have relocated to new facilitates in Billerica, MA and significantly expanded our workforce and production capabilities to meet the growing demand for laser-based technologies across a variety of industries.

© 2020 by Sheaumann Laser, Inc